IT Services major HCL Technologies said it has plans to double its semiconductor services business in the next 3/4 years following the capabilities it will develop around electronic chip plants to be set up by its group firm.
HCL Group is among the companies that have applied to set up electronic chip plants under the "Scheme for Compound Semiconductors" and HCL Tech will help HCL Corporate in the end-to-end processing of chips.
Ameer Saithu, executive vice president and BU Head, of HCL Tech, said, "One of the focus sectors for HCL Technologies, especially in engineering services is semi-chip. We plan to double the business in the next 3 to 4 years."
He added that the semiconductor wafer fab can be built in about 18 to 24 months from the date the government approves its application.
HCL Group plans to set up a chip wafer fabrication unit for 65-nanometer nodes that are used in the automobile, consumer durables, and low-cost devices segment.
Currently, HCL Tech is working with semiconductor companies like Intel. NXP, Taiwan Semiconductor Manufacturing Company, and Applied Materials in electronic chip production.
